Self destructing computer chip now are not film fictional only, PARC the chip developed by Xerox, introduced at a DARPA sponsored technology conference. The chips are manufactured out of the super tough Gorilla Glass used in most smartphones, they've been treated in a way that builds stress into it. When the self-destruct switch is activated, it turns on a small resistor in the chip that heats up fast and destroy the chip.
After the initial breakage, there is so much energy being released from the smashed, heated glass that its pieces continue breaking into smaller pieces for several seconds afterward. That's precisely why a secretive agency like DARPA finds them valuable: Chips that can self-destruct offer a certain level of absolute security, protecting secrets at the hardware level.
DARPA has an entire initiative around short-term, disposable technology called Vanishing Programmable Resources (VAPR). It has even funded self-destructing computer chips in the past, giving IBM a $3.45 million contract in 2014 to come up with its own take on a self-destructing computer chip.
“electronics made for everyday purchases are durable and last nearly forever, DARPA is looking for a way to make electronics that last precisely as long as they are needed. The breakdown of such devices could be triggered by a signal sent from command or any number of possible environmental conditions, such as temperature”said DARPA program manager Alicia Jackson in announcing the VAPR initiative two years ago